VP 6000 Vacuum

ASSCON's vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal for maintenance. Pump, valves and sensors are integrated in the base.

• Soldering of cased power components on printed circuit boards
• Area reflowing of components on heat-sink plates
• Soldering of power chips on base substrate with paste or solder foils
• Hermetic soldering of high frequency penetrations
• Making solder connections of large area electrical and mechanical components
• Elimination of voids with through-holes or other leaded connections for components to improve heat sinking
• Reflowing of large area SMTs or connectors on multilayers
• Repair of SMTs or conventional connectors in high-multilayers
• Simultaneous soldering of active and power components
• Soldering of 3D assemblies