Vacuum M
Variants
"Vacuum Plus" is a system for improving quality of solder joints. Voids are reduced in a vacuum chamber which significantly improves the quality of the soldered product.
- Voids will be reduced up to 99%, solder joints quality optimized
- Double sided PCB
- Setting Parameter: evacuation time; vacuum hold time; ventilation time; vacuum pressure
- Only one sealing surface of the vacuum chamber
Vacuum | 1 |
---|---|
Cycle time | 50 s |
Speed | 0.95 m/min |
Pre heat | 3 |
Process lenght | 4457 mm |
Peak zones | 3 |
Cooling zones | 2 |
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