QX250
Variants
| Series | AOI |
|---|---|
| fielddefinition.productarea.model.name | QX250 |
| PCB size | L: min 50 mm, max 405 mm W: min 40 mm, max 308 mm |
| Camera | 80 Megapixel Sensor on each SIM module |
| Resolut | 12 μm pixel size |
| Inspection speed | 110 cm2/sec |
| Solder Joint and Other Defects | Solder bridge, opens, lifted leads, wettability, excess and in sufficient solder, debris, Gold-finger contamination, pin-in-hole, bent pins, debris,and others |
| Image processing | Statistical Appearance Modeling (SAM™ ) Technology. Option: Autonomous Image Interpretation (AI²) Technology |
| Data import | Any column separated text file (Standard information required – ref. designator, XY, Angle, Part no.,) |
| Lamps | Strobe White Light (with dark/bright field) |
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